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3 V, RS = 0 Ω,
±1.5 pC max CL = 1 nF, Test Circuit 7 Off Isolation TBD dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, Test Circuit 8 Channel-to-Channel Crosstalk TBD dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, Test Circuit 10 Bandwidth –3 dB TBD MHz typ RL = 50 Ω, CL = 5 pF, Test Circuit 9 CS (OFF) 2 pF typ f = 1MHz CD (OFF) 6 pF typ f = 1MHz CD, CS (ON) 8 pF typ f = 1MHz POWER REQUIREMENTS VDD = +3.3 V Digital Inputs = 0 V or 3.3 V IDD 0.001 µA typ 1.0 µA max NOTES 1Temperature ranges are as follows: Y Grade: –40°C to +125°C. 2Guaranteed by design, not subject to production test. Specifications subject to change without notice. – 4 – REV. PrB PRELIMINARY TECHNICAL DATA ADG636 ABSOLUTE MAXIMUM RATINGS1 (TA = +25°C unless otherwise noted) V TSSOP Package, Power Dissipation . . . . . . . . . . 430 mW DD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V V θ DD to GND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.5 V JA Thermal Impedance . . . . . . . . . . . . . . . . . . 150°C/W V θ SS to GND . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to -6.5 V JC Thermal Impedance . . . . . . . . . . . . . . . . . . . 27°C/W Analog Inputs2 . . . . . . . . . . . . . . V Lead Temperature, Soldering (10 seconds) . . . . . . . 300°C SS –0.3 V to VDD + 0.3 V Digital Inputs2 . . . . . . . . . . . . . . . –0.3 V to V IR Reflow, Peak Temperature . . . . . . . . . . . . . . +220°C DD + 0.3 V or 30 mA, Whichever Occurs First NOTES Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA 1Stresses above those listed under Absolute Maximum Ratings may cause permanent (Pulsed at 1 ms, 10% Duty Cycle max) damage to the device. This is a stress rating only; functional operation of the device Continuous Current, S or D . . . . . . . . . . . . . . . . . . . 10 mA at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for Operating Temperature Range extended periods may affect device reliability. Only one absolute maximum rating may Extended (Y Version) . . . . . . . . . . . . . . –40°C to +125°C be applied at any one time. Storage Temperature Range . . . . . . . . . . –65°C to +150°C 2Overvoltages at EN, A0, A1, S or D will be clamped by internal diodes. Current should Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C be limited to the maximum ratings given. ORDERING GUIDE Model Option Temperature Range Package Description Package ADG636YRU –40°C to +125°C Thin Shrink Small Outline (TSSOP) RU-14 Table I. Truth Table for the ADG636 PIN CONFIGURATION 14-Lead TSSOP A1 A0 EN ON Switch (RU-14) X X 0 N O N E 0 0 1 S1A, S2A 1 A0 1 4 A1 0 1 1 S1B, S2A 2 EN 1 3 GND 1 0 1 S1A, S2B ADG636 V 3 1 2 SS VDD 1 1 1 S1B, S2B TOP VIEW S1A 4 1 1 S2A (Not to Scale) 5 1 0 S1B S2B 6 9 D1 D2 7 8 NC NC C A U T I O N ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although WARNING! the ADG636 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recom-ESD SENSITIVE DEVICE mended to avoid performance degradation or loss of functionality. REV. PrB – 5 – PRELIMINARY TECHNICAL DATA ADG636 TERMINOLOGY VDD Most Positive Power Supply Potential. VSS Most Negative Power Supply in a Dual Supply Application. In single supply applications, this should be tied to ground at the device. G N D Ground (0 V) Reference. IDD Positive Supply Current. ISS Negative Supply Current. S Source Terminal. May be an input or output. D Drain Terminal. May be an input or output. RON Ohmic resistance between D and S. ∆RON On resistance match between any two Channels i.e., RON max – RON min. RFLAT(ON)
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